Design and Manufacturing Services

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Engineering

The high-speed
networking and telecom
hardware expert

We offer end-to-end DMS, combining top-tier SI/PI simulation, 400G testing (including PCIe Gen 6), and software synergy with Taiwan manufacturing for ultimate stability assurance.

Networking Technology Leadership
Specialized in Both x86 & RISC Architectures
High-Frequency (Sub-6GHz, mmWave)
Advanced In-House Testing Capabilities   (PCIe 6.0, TSN, 400G Ethernet)
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Software Capability Synergy
Driver Development, BMC/IPMI, Kernel Hacking
Embedded OS Building
GUI Customization
Performance Optimization
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Expert in Design and Manufacturing
Design Flexibility
Made in Taiwan
Industry 4.0 Smart Manufacturing
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Outline drawing of a rack-mounted application delivery controller with multiple cooling fans.

Telecom Aggregation Switch

Cableless System
Broadcom  BCM56860
Front Panel
40x10G
40x10G + 4x100G
88x10G
Line drawing of a telecom aggregation switch with cooling fans, ports, and heat sinks on a black background.

Application Delivery Controller

Intel® Xeon® SP Processors (Ice Lake SP)
Broadcom BCM56784
Intel CVL E810 x 4
Intel® Stratix® 10 MX FPGA
Front Panel
4x400G
18x100G
In-House Testing

In-House Advanced Capbilti

Signal Integrity Simulation

Capability to do high speed signals simulation
PCIe Bus
SFI Interface
CAUI Interface
Others
Computer monitor with keyboard and mouse showing 3D circuit design diagrams and data charts.
Advanced Design System (ADS)
Engineering software interface showing PCB via definitions and 3D layered circuit board model.
3D Via Designer
Colorful eye diagram visualizing RX_out density over time in picoseconds from 0 to 80.
Pulse Amplitude Modulation (PAM-4) Simulation
Colorful vector field visualization with arrows showing current distribution intensity across a patterned surface.
Cadence–PowerDC, Current Distribution

Thermal Design and Simulation

Capability to provide the optimal thermal solutions for the system
Heat Sink Design and Selection
Fan Selection
Thermal Simulation/Velocity Simulation
System Placement Optimization for Thermal Consideration
Thermal Profile
Thermal Profile
Velocity Profile
Velocity Profile
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Electrical Analysis

Functional Validation Coverage
Low Speed Signals Measurement
PCIe Gen1/2/3/4/5/6
SATA 1.0/2.0/3.0
USB3.2 Gen1/2
Ethernet 400G/100G/25G/10G/2.5G...
HDMI1.4b/2.0/2.1
DisplayPort 1.2/1.4
Clock
Power Sequence
Power Noise
Crystal
I2C/SMBus
RGMII
MDC/MDIO
Others
Two eye diagrams and graphs showing voltage vs time and BER bathtub and TIE histogram data.
Oscilloscope screen showing electrical signal waveforms and measurements in various colors on a black background.
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Capability to validate Ethernet high speed electrical interface signals, including 10Gbps SFP+ , 100Gbps QSFP28, and 400Gbps QSFP-DD
Eye diagram showing voltage signal patterns with clear eye openings and intersecting waveforms.Oscilloscope display showing jitter, noise, and eye diagram analysis for an electrical signal test.BER plot graph with Q-scale on y-axis and unit interval on x-axis showing symmetrical data curves.

TSN

Novus ONE PLUS is a platform capable of time sensitive networking (TSN), and provides a powerful time synchronization underlay & covers full range of IEEE 802 wireless standards & Layer 2-3 protocol testing.

PCIe Gen 5/6

Tektronix DPO77002SX ATI Performance Oscilloscopes achieves 70 GHz and 200 GS/s  real time acquisition performance and delivers the most accurate capture of high-speed signal behavior.

400GE

AresONE is an 4-port 400GE solution with comprehensive L1 BERT, RS-544 FEC statistics, FEC symbol error density distribution, and PCS/FEC symbol error injection testing and Rx eye histogram stats and analysis.
Ixia Novus ONE PLUS network testing device with multiple ports and USB connectors on the front side.
Tektronix DPO77002SX ATI Performance Oscilloscope showing waveform on display.
Ixia AresOne 400GE network appliance with multiple ports on front panel isolated on black.
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Validation

Systematic Product Development

Process Flow

P0
Proposal
C0
Project Kickoff
RFQ
Proposal
Mutual Agreement
P1
High Level Design
Placement
Thermal simulation
Mechanical
Design rule
BOM cost
DFM/Assembly
DFT(Test)
C1
Circuit Design
Placement
P2
Detailed Design
Schematic
Layout
Design rule
CPLD Spec
EVT plan
DVT plan
DFMEA
Gerber out
C2
 Fab Release
Placement
Layout
Gerber Out
P3
Design Verification
EVT report
Signal integrity
Functional
Performance
Design margin
C3
ES Release
Build and test
P4
Design Maturity
DVT report
Compatibility
Reliability
Serviceability
Certification
Pilot-Run
C4
QS  Release
DVT Build and test
P5
Pilot-run
C5
Production Release
PR and Certification

Test Implementation Introduction

EVT
Build Quality Check
Test-to-Specification
Signal Quality Fine Tune
Performance Benchmark
Design Margin Test
Thermo Mapping
Power Consumption
Functionality Test
DVT
System Elements Assembly
Package Test
Environmental Test
Compliance Test
PVT
Compatibility Test
Performance Test
Stability Test
Initial Reliability Test
Customization

Customized Service for Tailor-Made Solutions

EVT
Build Quality Check
Test-to-Specification
Signal Quality Fine Tune
Performance Benchmark
Design Margin Test
Manufacturing Services
Serve Low Q’TY and High Mix
Flexible and Tailed-made Services
BTO, CTO Full Services
EMS Service
DMS Features
Shorten Time-to-Market
Flexible Design and Manufacture
Solid Quality Assurance System
Extensive DMS Experience
System Design Capability
High Availability Network Security
High-Speed Networking
Isolated/non-Isolated Power System
Wide Range of Operating Temp
Software Customization
Specific CMOS Defaults
Various Panel Support
Customized IC support
 Peripherals Support
Specific Function Design
Certification Assistance Services
We provide professional certification application services.
......
We provide highly experienced, tailored services to modify your product’s appearance.
Flowchart showing steps from request to implementation in engineering revision service process.
Change Scope:
We provide highly experienced, tailored services to modify your product’s appearance.
Logistic

NEXCOM Global Presence

Global flexible deployment simplifies changes and demands.
Organizational chart showing Taiwan as headquarters.Organizational chart showing Japan as subsidiary.Organizational chart showing Hungary as service center.Organizational chart showing USA as subsidiary.Stylized world map with labels for Taiwan headquarters, Hungary service center, Japan and USA subsidiaries.World map highlighting Taiwan headquarters, Japan and USA subsidiaries, and Hungary service center with their facilities.
After Sales Services pillar of NEXCOM's centralized management modelTechnical Support pillar of NEXCOM's centralized management modelLocal Support pillar of NEXCOM's centralized management modelHub Management pillar of NEXCOM's centralized management modelSLA Commitment pillar of NEXCOM's centralized management model
RMA and ECO rework
Refurbishment/Repackaging
Image Upgrade
SKU conversion/Reconfiguration
OS/Firmware Upgrade
IQC/OQC
Local First-Aid Solution
Quarter Closing Cycle Count
Backlog Report Review
Inventory Report
Physical Count
3:00PM/Next Business Day Order Shipping
Quarterly SLA performance Review
Around the Clock Operations for EOQ

Order Fulfillment Process

01
EDI PO Taking
02
Receiving into ERP
03
Issue Orders to Hubs
04
Pick & Pack
05
Scan SN & MAC, relabelling, shipping document preparation
06
Shipped to End Customers

How do we automate data transmission to maintain supply chain visibility?

Automated Daily Reporting
Open Order / HUB Stock Status Report by IT system twice  a day.
Automatic Order Notification
After-Sales Services

Post-Sales Support

Introduction

Our dedicated After Service division ensures the long-term reliability and operational efficiency of your equipment. We leverage efficient processes and a global support structure to deliver the highest standards of service and client commitment.
Basic Service Warranty
Global Service Network
Image upgrade ECO up Rev
eRMA Portal for traceability
24M warranty for off the shelf products
Additional Services
Advanced RMA replacement
Re-branding Repackaging
Component Replacement
Refurbishment ETN
Process Flow
01
EDI PO Taking
02
Identify H/W Failure
03
RMA Register & Return Unit
04
Process RMA Receiving
05
Problem Verification
06
Repair & ECO upgrade
07
Function Test
08
Refurbish (when requested)
09
Return w/ RMA Report

Online eRMA System

Welcome to NEXCOM web-based eRMA system. This eRMA website has complete online technical support and full functionality of RMA services, which is available 24/7 to serve all of your technical and RMA needs. You can conveniently access the eRMA website from anywhere with Internet access to request RMA Number, track RMA Status, and even check the product warranty information instantly.
Engineering Change Orders (ECO) systematically manage product modifications throughout the mass production lifecycle. This process is vital for resolving design issues, achieving cost efficiency, and maintaining material sourcing stability while ensuring continuous product performance and regulatory adherence.
ECO Change and Version Traceability Management
ECO Control
ECO tracking from Shop Floor System
Dialog box showing module selection with ECO CONTROL chosen and OK and Cancel buttons.
Revision Check
Revision Check for Return Units
Chip labeled B8 (20EE) next to a table listing BOM and BOARD_ASSEMBLY codes with B8 and 20EE highlighted.
ECO Upgrade
ECO Upgrade (when requested)
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Process Flow
No
End
No
Close & Archive
Archive to project file
No
No
Implementation /
master files updated
01
Apply for ECO
Request by Applicant
02
Yes
Request  notification to dept. mgr
Approval by department manager
03
Yes
Evaluation & revision of change request
Approval by Validation dept. manager
04
Yes
Hold review meeting or countersign
ECO Review Team
05
Yes
ECO approval
Meeting conclusion
06
Yes
Any safe regulations involved?
Release by Document center and filing
07
Notify safety dept.
Responsible manager approval

Component Approval Process

New Component Approval Process
Flowchart showing New Component leading to P/N Application Process and Datasheet Process steps.
Process Flow
01
Applicant
02
Supervisor Sign off
03
Component Engineering
04
Document Control
05
Sourcing
06
Footprint Library
07
End
Datasheet Process Flow
01
Applicant
02
Component Engineering
03
Material Procurement
04
P/N Published
QVL Approval Process
Flowchart showing QVL Substitute branching to P/N Application Process and Validation Process.
Process Flow
01
Applicant
02
Supervisor Sign off
03
Component Engineering
04
Document Control
05
Sourcing
06
Footprint Library
07
End

Validation Process

Buyer
#3 Component Safety
Regulatory Compliance team
01
Apply for ECO
02
Engineering Supervisor
03
#1 Component Engineering
04
#4 Supervisor-CE team
05
Project HW Engineer
06
RD Manager
07
Document Control
08
#4 Component Engineering
09
Notification Group
#1:
Classify the component submitted and conduct tests according to the test items of the category, and submit the report after test complete.
#2:
Check if all test items passed in the report done by CE team
#3:
Check if the substitute item meeting all required regulatory compliance (e.x. :Power Adapter, Fuse Fan, Battery, PCB) meeting US/EU standards
#4:
Facilitate datasheet process completion
Green MFG

NEXCOM Environmental Sustainability Process and Future Target Setting Planning

Orange robotic arm and autonomous robot tending plants in a modern indoor greenhouse.
2050
Achieve carbon neutrality and reach the net-zero target!
2030
Reduce carbon dioxide emissions to 55% of 2024 levels
2025
Reduction Target: Reduce carbon dioxide emissions to 55% of 2022 levels by 2030
Commit to achieving carbon neutrality by 2050 to meet the net-zero target
Independent report on Task Force on Climate-related Financial Disclosures (TCFD)
2024
Initiate greenhouse gas emission inventory verification for the Taiwan subsidiaries
Implement Task force on Climate-related Financial Disclosures (TCFD) in ESG sustainability reports
Hua-Ya Factory introduces smart meters into its production process
Achieve corporate carbon reduction thermometer of 1.5°C
2022
Initiate greenhouse gas emission inventory verification for the Taiwan subsidiaries
Implement and Obtained ISO 14064-1 Greenhouse Gas Emission Verification
Implement and Obtained ESG Sustainability Verification
Reduction Target: Reduce carbon emissions by 1% annually, with increased carbon reduction efforts based on broader environmental conditions
Reduction Target: Reduce carbon dioxide emissions to 55% in 2030
Declared that carbon dioxide emissions will reach net zero by 2050 and achieve carbon neutrality
2005
Obtained ISO 14001: 2004 environmental management system certification
NEXCOM Greenhouse Gas Emission Reduction Performance
Year
2022
2023
2024
Electricity Saved
(kWh)
47,393
194,562
236,780
Carbon Emissions Reduced
(metric tons CO2e)
31.1908
105.6225
126.4784

NEXCOM continues to implement energy-saving and carbon reduction initiatives through equipment replacement, process optimization, and energy management measures to gradually enhance energy efficiency year by year. From 2022 to 2024, a cumulative 236,780 kWh of electricity was saved, resulting in a carbon reduction benefit of 126.4784 metric tons CO2e. Compared to the baseline year 2024 total emissions of 5,279.7381 metric tons CO2e, this represents a 2.4% reduction, demonstrating the company's tangible results in improving energy efficiency and taking climate action.

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